Quadro-Focusing on the R&D of high-end semiconductor packaging equipment

Successfully developed in 2018, the product line now includes 10 models—covering 12-inch, 8-inch, and 6-inch formats—as well as dual-axis and single-axis versions. These machines are designed for high-precision cutting applications, capable of handling silicon, SiC wafers, glass substrates, and various other base materials with cutting accuracy within 3 µm, ensuring exceptional stability. The technology has undergone more than four years of rigorous production-line validation.

Package Singulation Dicing Saw

Sharing wafer dicing machine technology that delivers high precision, exceptional speed, and proven stability—validated on production lines by over 20 customers. This solution seamlessly handles cutting requirements for DFN, QFN, and BGA packages, as well as ceramic substrates and MiniLED light boards, offering unmatched cost efficiency, rapid delivery, and extended product longevity.

Flip-chip Mounter

Suitable for die bonding in advanced packaging processes, this system precisely places diced die onto the corresponding substrates using a non-contact visual alignment system with high accuracy and robust automatic correction capabilities. Equipped with a high-speed linear motor drive, it enables rapid, in-line material changes for increased efficiency.

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Wafer Dicing Saw

Package Singulation Dicing Saw

Flip-chip Mounter

About Us

Focusing on the R&D, production, and sales of high-end semiconductor packaging equipment.

Guangdong Quadro Semiconductor Equipment Co.,Ltd was established in 2016 and leveraging maturetechnology,has developed strong capabilities in independent product development.It is a high-techenterprise integrating research and development,design,manufacturing,and sales.The company isdedicated to the research and manufacturing of semiconductor equipment and vision inspection devices.

Blog

2025-10

Kozhoo Semiconductor Makes It Into Guangdong's Top 50; Domestic Production of Wafer Dicing Machines to Accelerate

Recently, the highly anticipated 10th "Maker China" Guangdong Provincial SME Innovation and Entrepreneurship Competition—and the 9th "Maker Guangdong" Competition—delivered exciting news: Guangdong Quadro Semiconductor Equipment Co., LTD. impressed judges with its entry, the "High-Precision Fully Automatic Wafer Dicing Machine." Thanks to its cutting-edge technology and remarkable industry value, the company stood out from nearly 3,500 entries across the province, earning a spot among the competition's top 50 finalists. This achievement cements Quadro as a standout player in China's domestic semiconductor equipment sector.

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2025-10

Kozhoo Semiconductor's "High-Precision Fully Automatic Wafer Dicing Machine" project wins an award.

According to a report by China Securities Journal (reported by journalist Xia Zihang), on September 29, reporters learned from Kozuo Semiconductor that the company’s entry—a high-precision, fully automated wafer dicing machine—stood out among nearly 3,500 competing projects at the 10th Guangdong Provincial SME Innovation and Entrepreneurship Competition under the "Maker China" initiative, as well as the 9th "Maker Guangdong" competition. Thanks to its cutting-edge technological capabilities and significant industry value, Kozuo Semiconductor earned a spot in the top 50 of the competition, cementing its position as a leading player in China’s domestic semiconductor equipment sector.

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2025-09

Kozhong secures 70 million yuan in Series A funding, accelerating the localization of wafer dicing machines.

Recently, Kozuo Semiconductor completed its first post-commercialization funding round, raising 70 million yuan. This investment will undoubtedly accelerate the commercial rollout of Kozuo’s wafer dicing machines, while also boosting China’s progress in developing domestically produced high-end packaging equipment.

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For inquiries about our products or price list, please leave us a message, and we’ll get back to you within 24 hours.

Guangdong Quadro Semiconductor Equipment Co., Ltd.

Phone: 13509020466

Landline: 0769-28829280

Email: Sd01@qrobotweb.com

Address: Second Floor, Building 7, Block F, Tian'an Digital City, Nancheng District, Dongguan City, Guangdong Province

by:300.cn

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Package Singulation Dicing Saw

Package Singulation Dicing Saw

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