Shanghai Xinzhu: Embarking on a New Journey Together | Guangdong Kezhuo Semiconductor Cordially Invites You to SEMICON China 2026

SEMICON China 2026 will be held from March 25 to 27, 2026 at the Shanghai New International Expo Center. Guangdong Quadro Semiconductor Equipment Co., LTD. will showcase its core products, including wafer dicing machines, committed to providing high-precision, high-stability, and high-efficiency solutions for the semiconductor industry. The company cordially invites industry peers, new and existing customers, and partners to visit Booth N4-N4625 to discuss technology and collaboration opportunities.

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2026/03/20

Kozhoo Wafer Dicing Machine Debuts at SEMI-e 2024, the Shenzhen International Semiconductor Exhibition

Guangdong Kezhuo Semiconductor Equipment Co., Ltd. is dedicated to the research, development, and manufacturing of advanced semiconductor packaging equipment. Benchmarking against international peers, the company aspires to become China's leading domestic brand in cutting-edge packaging equipment solutions. Its key products include wafer dicing machines, IC final-cutting systems, high-speed sorting machines for finished ICs, and FC flip-chip die attach machines—all at the forefront of advanced packaging technology.

2024/07/11

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Address:Building 7, Block F, Tian'an Digital City, Nancheng District, Dongguan City, Guangdong Province

Copyright: Guangdong Quadro Semiconductor Equipment Co., LTD.

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