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Fully Automatic Thinning Machine QG1202
Category:
Excellent structural design.
Reliable and convenient operating system.
Details
• Product Advantages
| • Equipped with a mechanically engineered structure for high-precision grinding To achieve high-precision, high-quality machining, the Z1 and Z2 axes are equipped with spindles that offer high rigidity, low vibration, minimal rotational speed fluctuation, and excellent thermal stability. The wafer rotary table also features an air-bearing assembly that delivers high rigidity, low vibration, low thermal expansion, and minimal rotational speed fluctuation. • Adopts a high-power spindle to enhance machining efficiency. Equipped with an 11 kW high-power spindle, it is suitable for wafer processing of various materials, effectively enhancing processing efficiency and unit production capacity. • Enhance operational convenience Equipped with a graphical user interface, the page structure is simple and intuitive, enabling quick and easy access to the desired page. • Increase productivity per unit area The equipment has a projection footprint of 1,260 mm × 2,800 mm, representing approximately a 20% reduction in floor space compared with comparable Φ12-inch wafer thinning machines. |
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• Enhance cleaning performance, protect the wafer surface, and ensure stable product quality. Pre‑grinding cleaning station (optional): After the wafer is positioned, robotic arm 1 picks up the wafer and uses a sponge or brush at the cleaning station to clean the non‑grinding surface, removing surface contaminants, protecting the wafer surface, ensuring uniform and stable suction, maintaining grinding accuracy, and improving yield. Post‑grinding cleaning station (optional): After grinding, robotic arm 2 picks up the wafer and uses a sponge to clean the non‑grinding surface, thoroughly removing backside grind debris and slurry while protecting the cleaning tray on the wash station—ideal for high‑end thinning processes. [1] The robotic gripping device removes the workpiece from the wafer cassette and places it on the alignment stage, where centering is performed. [2] Transfer arm 1 places the workpiece on the wafer rotary table. [3] The workpiece is ground on the Z1 and Z2 axes. [4] The transfer arm 2 removes the workpiece from the wafer carousel and places it on the cleaning rotary table. [5] Cleaning and drying. [6] The robotic gripping device places the workpiece into the wafer cassette. |
• Product Specifications and Parameters
Specifications |
Unit |
QG1202 |
|
Wafer diameter |
- |
Ø6”, ø8”, ø12” |
|
Grinding method |
- |
Wafer Rotary In-Feed Grinding |
|
Grinding wheel |
mm |
Ø300 |
|
Spindle |
Rated power |
kilowatt |
11 |
Rated speed |
min-1 |
1,000 – 4,000 |
|
Equipment Dimensions (W x D x H) |
mm |
1,260 x 2,800 x 2,150 |
|
Equipment |
kilogram |
4,000 |
|
• Terms of Use
→Use clean compressed air with an atmospheric-pressure dew point between -10°C and -20°C, a residual oil content of 0.1 ppm, and a filtration accuracy of 0.01 μm, achieving a purification efficiency of 99.5% or higher.
→ The room temperature in the space where the mechanical equipment is located shall be maintained between 20°C and 25°C, with temperature fluctuations limited to ±1°C.
→ The cutting fluid temperature shall be maintained at room temperature plus 2°C (with a fluctuation range of ±1°C), and the coolant temperature shall be maintained at room temperature (with a fluctuation range of ±1°C).
→Avoid external vibrations such as impacts and perceptible vibrations that could affect the equipment. Do not install the equipment near fans, ventilation openings, or devices that are prone to generating high heat or oil contamination.
→This equipment will use water. To prevent damage caused by water leaks, the equipment shall be installed in a location equipped with a waterproof floor and drainage facilities.
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Address:Building 7, Block F, Tian'an Digital City, Nancheng District, Dongguan City, Guangdong Province
