Company Profile
Guangdong Quadro Semiconductor Equipment Co., Ltd.
Strive for excellence, continuously innovate
Guangdong Quadro Semiconductor Equipment Co., Ltd. was established in 2016 and is registered in Dongguan City. It has been focusing on the research, development, production and sales of high-end semiconductor packaging equipment for a long time. The company is committed to becoming a semiconductor packaging equipment and solution provider based in China and serving the world. Adhering to independent innovation, it successfully developed a high-precision 12-inch Dual Spindle Full-automatic Wafer Dicing Saw in 2018. After years of in-depth cultivation, the company has now developed into an equipment provider with a series of products such as Wafer Dicing Saw,Package Singulation Dicing Saw,JigSaw, and Flip-chip Mounter. The company's equipment benchmarks international standards in key performance. With excellent performance, significant cost advantages, flexible delivery cycles and efficient local services, it provides a reliable choice and strong support for domestic packaging customers to achieve self-control of the supply chain and reduce costs and increase efficiency.
The company will continue to deeply cultivate the field of semiconductor packaging equipment, actively seize market development opportunities, continuously improve equipment performance and stability through continuous technological innovation and product optimization, provide customers with more efficient and reliable packaging solutions, and help customers improve their process levels and production efficiency.
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Address: Second Floor, Building 7, Block F, Tian'an Digital City, Nancheng District, Dongguan City, Guangdong Province
