Job Title

Department

Educational qualifications

Release Date

Mechanical Designer

Engineering Department

Bachelor's degree

2025-09-17

Job Requirements: 1. Proficient in using SolidWorks and AutoCAD; 2. Skilled in office software such as PowerPoint, Word, and Excel; 3. Possess 2–3+ years of mechanical design experience and capable of independently completing design tasks; 4. Responsible for the design and development of automated machinery equipment, including structural design, component selection, and transmission system design, etc.; 5. Strong hands-on skills, excellent teamwork spirit, a strong sense of responsibility, and outstanding communication abilities; proactive and highly motivated in your work; 6. Candidates should hold an associate degree or higher in a mechanical design-related field; 7. Age requirement: 20–40 years old. Job Responsibilities: 1. Complete the assembly and calibration of precision components for wafer dicing machines, such as guide rails, bearings, and optical module brackets; 2. Use tools like torque wrenches and micrometers to ensure assembly dimensional tolerances are maintained within ≤0.005mm; 3. Collaborate with engineers during pre-commissioning of components, documenting assembly data and identifying any assembly-related errors; 4. Maintain a clean and controlled environment in the assembly area to prevent dust and static electricity from contaminating components.

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CNC Operator

Production Department

Unlimited

2025-09-17

Job Requirements: 1. Proficient in independently operating a machining center, responsible for running CNC equipment to process mechanical parts. 2. Able to interpret technical drawings and skilled in using measuring tools to self-inspect parts. 3. Willing to follow instructions and complete production tasks on time. 4. Responsible for performing routine maintenance on machine tools to ensure their smooth operation. Preferred Qualifications: 5. Familiarity with FAUNC CNC systems. 6. At least 1–2 years of hands-on experience operating CNC machining centers. 7. Willingness to work night shifts. 8. Age requirement: 18–45 years old. Job Responsibilities: 1. Independently operate the machining center and oversee the processing of mechanical parts using CNC equipment. 2. Set cutting parameters according to process documentation, monitor the machining process, and prevent tool wear that could lead to dimensional inaccuracies. 3. Ability to read technical drawings and use measuring tools to verify part quality during self-inspection. 4. Ensure the daily maintenance of CNC equipment to maintain stable and reliable machining operations.

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Mechanical Assembler

Production Department

High school

2025-09-17

Job Requirements: 1. High school diploma or higher. 2. Preference will be given to candidates with experience in car, milling, grinding, and fitting processes. 3. Ability to read mechanical CAD drawings and 3D blueprints, and perform mechanical assembly based on these designs. 4. Familiarity with mechanical assembly processes and assembly precision requirements. 5. Positive work attitude, strong hands-on skills, and excellent teamwork spirit. 6. Age requirement: 18–45 years old. Job Responsibilities: 1. Assemble fixtures and equipment according to provided drawings. 2. Assist engineers in debugging equipment operations. 3. Maintain proper 5S practices at the workplace. 4. Complete other tasks assigned by your supervisor.

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Electrical Engineer

R&D Department

Junior college

2025-09-17

Job Requirements: 1. Major in Electronics, Electrical Engineering, or a related field; proficient in PLC programming. 2. 3–5+ years of experience in electrical design for industrial automation equipment. Candidates with experience in semiconductor equipment development are preferred (outstanding recent graduates also welcome). 3. Familiar with electrical wiring, electrical control cabinet design, and component selection. Must be skilled in programming one of the following PLC systems: Mitsubishi, Omron, Keyence, etc., and have a strong understanding of industrial bus communication protocols. Proficient in using electrical drafting software such as AUTOCAD to create electrical schematics, wiring diagrams, and other design documents. Candidates should possess solid theoretical knowledge of electrical control systems and be well-versed in selecting appropriate electrical components. 4. Strong sense of responsibility, excellent teamwork skills, outstanding communication and coordination abilities, and a humble yet capable attitude—able to collaborate closely with mechanical and software teams. Additionally, candidates should demonstrate strong problem-solving skills, stress tolerance, and the flexibility to travel and work overtime when necessary. 6. Age requirement: 18–45 years old Job Responsibilities: 1. Based on the technical requirements of wafer dicing machines, design the electrical control architecture, develop electrical solutions and schematics, select appropriate electrical components, and prepare the BOM. Use EDA software to generate electrical drawings and compile design documentation, including PLC/HMI programs. 2. Expertise in programming Mitsubishi, Panasonic PLCs, and touch-screen interfaces; assist in equipment assembly and debugging processes. 3. Equipment Debugging: Oversee the electrical debugging of equipment, working closely with mechanical and software teams to complete full machine integration. Resolve any electrical issues encountered during the debugging phase, optimize equipment performance, and ensure stable, reliable operation. 4. Technical Support: Provide electrical technical support throughout the production, manufacturing, and testing phases of the equipment. Guide electrical assembly and integration tasks, and participate in on-site installation and after-sales maintenance. Diagnose and address electrical faults occurring at customer sites.

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Equipment Sales Manager

Business Department

Bachelor's degree

2025-10-15

Job Requirements: 1. Bachelor’s degree or above; candidates with majors in Marketing, Automation, Mechanical Engineering, Semiconductor Engineering, or related fields are preferred. 2. At least 3–5 years of experience in semiconductor equipment sales management. Priority will be given to those with experience in selling wafer dicing machines or other semiconductor packaging equipment. 3. Familiarity with the semiconductor industry’s supply chain structure, market trends, and customer needs. Strong communication, negotiation, and market analysis skills are essential. 4. In-depth knowledge of the semiconductor packaging market, along with established client relationships. Candidates should have solid English reading and writing skills and be proficient in semiconductor-specific technical terminology. 5. A strong sense of responsibility and excellent teamwork skills, with the ability to travel frequently. Must possess independent problem-solving capabilities and high resilience under pressure. 6. Age requirement: 20–45 years old Job Responsibilities: 1. Responsible for expanding the market for wafer dicing machines by identifying potential customers through various channels, building and maintaining strong client relationships. Develop tailored sales strategies and plans based on market demands and competitive dynamics, ensuring the achievement of sales targets. 2. Engage in in-depth discussions with clients to thoroughly understand their business needs and challenges, providing customized wafer dicing machine solutions. Assist customers in equipment selection and process evaluation, ensuring that the equipment meets their production requirements. 3. Conduct business negotiations with clients, including product demonstrations, price quotations, and contract term discussions, to finalize sales agreements. Oversee the signing, execution, and monitoring of sales contracts, ensuring smooth contract fulfillment and timely payment collection. 4. Regularly follow up with clients to gather feedback, address any issues, and enhance customer satisfaction and loyalty. Maintain long-term, positive communication and collaboration with clients to encourage repeat purchases and expand market share. 5. Collaborate closely with internal departments such as Marketing, Technology, and Production to jointly drive project implementation and delivery. Coordinate company resources effectively to ensure timely responses to customer needs, delivering exceptional experiences and enhancing overall customer satisfaction.

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Equipment Sales Engineer

Business Department

Bachelor's degree

2025-10-15

Job Requirements: 1. Educational Background: Bachelor’s degree or above in a relevant field such as Electronics, Mechanical Engineering, or Semiconductor Technology. 2. Work Experience: At least 3 years of experience in semiconductor packaging production processes, or in sales roles related to semiconductor equipment. 3. Skill Requirements: - Proficiency in semiconductor packaging processes and hands-on experience with equipment; understanding of the operational principles and applications of key packaging machinery. - Familiarity with the semiconductor packaging market and existing customer network. - Strong English reading and writing skills, with a solid grasp of technical terminology specific to the semiconductor industry. 4. Personal Qualities: - Strong sense of responsibility and excellent teamwork skills. - Ability to travel frequently and resilience under pressure. Job Responsibilities: 1. Technical Support: - Provide technical consultation and tailored solutions for semiconductor clients regarding packaging equipment such as wafer dicing machines and final product cutting machines. - Assist the sales team in addressing technical challenges encountered by customers during product usage. - Conduct equipment demonstrations, technical discussions, and training sessions to ensure clients can effectively utilize the products. 2. Sales Collaboration: - Support the sales team in achieving sales targets by offering technical expertise and guidance. - Participate in client process requirement assessments, providing professional recommendations to help customers select the most suitable equipment. - Monitor project progress closely, ensuring timely resolution of any technical issues to enhance customer satisfaction.

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Equipment Debugging Technician

R&D Department

Junior college

2025-10-15

Job Requirements: 1. Candidates must hold a full-time college diploma or higher, preferably in a field such as Mechatronics, Electrical Engineering, Automation, Mechanical Engineering, or Semiconductor-related disciplines. For candidates with extensive experience, the educational requirement may be relaxed accordingly. 2. 1–3 years of experience in semiconductor equipment debugging is required. Priority will be given to those with hands-on experience in precision wafer dicing equipment or automated systems. Familiarity with the principles and operation of diamond blade/laser cutting equipment is highly desirable. Outstanding recent graduates may also be considered on a case-by-case basis. 3. Candidates should understand the operational principles of components like motors, cylinders, and sensors, possess foundational knowledge of circuitry, and have basic proficiency in PLC logic. They should be able to interpret circuit diagrams and demonstrate independent troubleshooting skills. 4. Applicants should be familiar with the basic processes involved in semiconductor packaging, capable of reading engineering drawings such as wafer maps and cutting path diagrams, and equipped with fundamental documentation skills. 5. Strong engineering analysis and logical thinking abilities are essential, along with practical hands-on skills. Candidates must be willing to undertake temporary business travel and strictly adhere to semiconductor equipment safety operating procedures. 6. Age requirement: 20–40 years old. Job Responsibilities: 1. Participate in pre-sales testing and debugging of equipment to ensure that performance meets specified standards. 2. Address any anomalies identified before equipment shipment, gathering relevant information and reporting any defects or issues. 3. Collaborate on-site installation, commissioning, customer training, and ongoing technical support following equipment delivery. 4. Document and report any on-site issues, assisting in optimizing equipment performance and refining process workflows. 5. Complete other tasks assigned by your supervisor as needed.

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Equipment Distribution Technician

Production Department

Vocational secondary school / Technical secondary school

2025-10-15

Job Requirements: 1. Candidates should have a secondary vocational school diploma or higher, preferably in Electrical Engineering, Mechatronics, Electrical Automation, or a related field. For candidates with extensive experience, the educational requirement may be relaxed accordingly. 2. Applicants must hold a Low-Voltage Electrician Certificate; preference will be given to those who also possess a High-Voltage Electrician Certificate. Candidates with 1–3 years of experience in factory power distribution, equipment assembly, or the semiconductor/electronics industry—particularly those familiar with secondary wiring—are strongly preferred. 3. Candidates should be well-versed in the performance and operating principles of both high- and low-voltage distribution equipment, with hands-on skills in electrical wiring, circuit testing, and other practical tasks. Priority will be given to those who can read electrical schematics and wiring diagrams, as well as understand basic PLC logic and the characteristics of common brand-name electrical components. 4. Candidates must demonstrate strong problem-solving abilities for diagnosing and addressing basic electrical faults, along with excellent attention to detail and a strong sense of responsibility. They should also exhibit effective teamwork and communication skills, and be willing to travel when required. 5. Age requirement: 18–40 years old. Job Responsibilities: 1. Participate in the installation, secondary wiring, and commissioning of electrical components on equipment. Independently complete wiring tasks for electrical panels and entire devices based on BOMs and electrical diagrams. 2. Identify and resolve issues such as short circuits or electrical leakage, ensuring reliable grounding, and maintain detailed maintenance records. 3. Familiarize yourself with the installation and wiring of non-standard equipment, taking charge of electrical circuit installation and machine assembly tasks. Collaborate closely to perform pre-delivery power-up tests and troubleshoot any issues before equipment leaves the facility. 4. Complete other tasks assigned by your supervisor as needed.

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Address: Second Floor, Building 7, Block F, Tian'an Digital City, Nancheng District, Dongguan City, Guangdong Province

Copyright: Guangdong Quadro Semiconductor Equipment Co., LTD.

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