Kozhoo Wafer Dicing Machine Debuts at SEMI-e 2024, the Shenzhen International Semiconductor Exhibition

Guangdong Kezhuo Semiconductor Equipment Co., Ltd. is dedicated to the research, development, and manufacturing of advanced semiconductor packaging equipment. Benchmarking against international peers, the company aspires to become China's leading domestic brand in cutting-edge packaging equipment solutions. Its key products include wafer dicing machines, IC final-cutting systems, high-speed sorting machines for finished ICs, and FC flip-chip die attach machines—all at the forefront of advanced packaging technology.

2024/07/11

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Address: Second Floor, Building 7, Block F, Tian'an Digital City, Nancheng District, Dongguan City, Guangdong Province

Copyright: Guangdong Quadro Semiconductor Equipment Co., LTD.

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