Kezhuo: Domestication of wafer dicing machines will accelerate.

Recently, Kozhoo has accelerated efforts to commercialize its wafer dicing machines, which will also help advance the localization of China's high-end packaging equipment industry.

2025/05/07

Kozhoo Semiconductor Completes RMB 70 Million Series A Funding; Domestic Production of Wafer Dicing Machines Expected to Accelerate.

According to a report by China Securities Journal, a subsidiary of the Shanghai Securities News (reported by journalist Xia Zihang), on May 6, Kezhuo Semiconductor announced via its official WeChat account that it recently closed its first post-commercialization funding round, raising 70 million yuan. This significant investment will accelerate the commercial rollout of Kezhuo's wafer dicing machines while also supporting China's efforts to advance the localization of high-end packaging equipment.

2025/05/07

Kezhuo Semiconductor focuses on the production of high-end packaging equipment and may launch its first round of PE financing within the year.

Beijing, Nov. 22 (by Kang Gengfu) – The 21st China International Semiconductor Expo (IC China 2024), hosted by the China Semiconductor Industry Association, recently kicked off at the Beijing National Convention Center.

2024/11/22

Wang Fuguo of Kozhao Semiconductor: AI Server Construction Accelerates, Driving Demand for Wafer Dicing and Advanced Packaging Technologies | Exclusive Interview

"Global semiconductor sales are gradually emerging from a downturn, paving the way for new opportunities in industry development," said Chen Nanxiang, Chairman of the China Semiconductor Industry Association, at the recently held 21st China International Semiconductor Expo (referred to as the Expo).

2024/11/21

Kozhoo Wafer Dicing Machine Debuts at SEMI-e 2024, the Shenzhen International Semiconductor Exhibition

Guangdong Kezhuo Semiconductor Equipment Co., Ltd. is dedicated to the research, development, and manufacturing of advanced semiconductor packaging equipment. Benchmarking against international peers, the company aspires to become China's leading domestic brand in cutting-edge packaging equipment solutions. Its key products include wafer dicing machines, IC final-cutting systems, high-speed sorting machines for finished ICs, and FC flip-chip die attach machines—all at the forefront of advanced packaging technology.

2024/07/11

Rejecting the "bottleneck"! A NanCheng enterprise spends six years honing its skills to achieve a homegrown comeback.

On the eve of the Spring Festival, Guangdong Quadro Semiconductor Equipment Co., LTD. (hereafter referred to as "Kerzhuo") continued to operate at full speed in its assembly and debugging workshops, with assembly workers and technicians making a final push to meet pre-festival order deadlines.

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2024/02/02

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Address: Second Floor, Building 7, Block F, Tian'an Digital City, Nancheng District, Dongguan City, Guangdong Province

Copyright: Guangdong Quadro Semiconductor Equipment Co., LTD.

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