Other emerging fields
Other emerging fields
As technology evolves, the application scope of wafer dicing machines continues to expand, now encompassing an even wider range of high-precision manufacturing applications.
- Radio Frequency (RF) Devices: For example, 5G base station RF chips and satellite communication components typically use wafers made of GaAs or GaN materials. Since these materials are highly sensitive to electromagnetic interference in RF circuits, cutting must be performed using low-impedance tools to minimize such interference.
- Quantum chip sector: The quantum chip wafers integrate qubits—such as superconducting qubits and semiconductor quantum dots—and require cutting to be performed under ultra-low-temperature, magnetically shielded conditions. This ensures that no stress or electromagnetic interference disrupts the fragile quantum states. Currently, the "cryogenic wafer dicer," which is still in the R&D phase, has already begun to be implemented.
- Sensor array: Such as infrared sensor arrays and image sensors (CIS), cutting must ensure the consistency of each pixel unit within the array, preventing cutting deviations that could lead to the failure of some pixels.
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