Semiconductor Integrated Circuit (IC) Field
Semiconductor Integrated Circuit (IC) Field
This is the most critical and widely used application scenario for wafer dicing machines, spanning chip manufacturing across industries—from consumer electronics to industrial control—and serving as an "essential link" in the global semiconductor industry chain.
- Logic ICs—such as CPUs (Central Processing Units), GPUs (Graphics Processing Units), and FPGAs (Field-Programmable Gate Arrays)—require extremely high cutting precision (with typical kerf widths below 50 μm). To prevent cutting-induced stress from compromising chip performance, these chips must be processed using either high-precision diamond blades or laser-cutting technology. For instance, CPU wafers from companies like Intel and AMD are first divided into individual core chips via a dicing machine, before being packaged for final assembly.
- Memory ICs—including DRAM (Dynamic Random Access Memory) and NAND Flash—typically feature high integration density and small chip sizes (for instance, mobile phone storage chips may have die dimensions of just a few millimeters). These wafers require precision "damage-free cutting" machines to prevent data loss or performance degradation in the embedded memory cells. A prime example is the NAND wafer cutting process carried out by companies like Samsung and SK Hynix.
- Power semiconductors (Power ICs)—such as IGBTs (Insulated Gate Bipolar Transistors) and MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors)—are commonly used in high-voltage applications like new-energy vehicles and photovoltaic inverters. Their wafers are typically thick wafers (>100 μm in thickness) or made from compound semiconductors like SiC and GaN, requiring dicing machines with enhanced cutting force and superior heat dissipation capabilities. At the same time, these machines must ensure precise cutting surface flatness to prevent any compromise in the chip's voltage-withstanding performance.
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