The field of Micro-Electro-Mechanical Systems (MEMS)
The field of Micro-Electro-Mechanical Systems (MEMS)
MEMS are miniature devices that integrate mechanical structures, sensors, and circuits directly onto a wafer—demanding "low stress" and "high consistency" during the dicing process, far exceeding the requirements of traditional ICs. They represent a critical niche application for wafer dicing machines.
- Sensor types include: acceleration sensors (e.g., used in phone step counters and car airbags), gyroscopes (essential for drone navigation and VR devices), and pressure sensors (such as those found in tire-pressure monitoring systems and smartwatch heart-rate detectors). These MEMS devices contain tiny internal mechanical structures—like cantilever beams or thin films—that can fail directly if stress or vibrations occur during the cutting process. To prevent such failures, advanced techniques like "laser stealth dicing" or "ultra-thin blade + low-speed cutting" are employed. For instance, Bosch and STMicroelectronics utilize these methods for slicing MEMS sensor wafers.
- Actuator types—such as micro-motors (used in micro-robots and medical endoscopes) and RF MEMS switches (for 5G base stations and satellite communications)—feature wafers that integrate both mechanical actuation structures and RF circuits. Cutting these devices requires simultaneously preserving the integrity of the mechanical components while ensuring electrical insulation of the circuitry.
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