The field of optoelectronics
The field of optoelectronics
Optoelectronic devices rely on the photoelectric conversion properties of semiconductor materials. Wafers are typically made from compound semiconductors such as GaAs, InP, and GaN. Cutting these materials requires careful adaptation to their brittleness and high hardness, while also ensuring that optical performance is not compromised.
- Optical communication devices: Such components as lasers (LDs), photodetectors (PDs), and optical modules are used in fiber-optic communication networks. These wafer-based chips are incredibly small— for instance, LD chips measure just 0.5mm × 1mm—and must maintain impeccable flatness of their optical windows (as any unevenness would compromise light-coupling efficiency). To achieve this precision, high-accuracy laser cutting or diamond-blade slicing is essential.
- Display device: For epitaxial wafers used in technologies like Mini LED and Micro LED, the cutting process requires precisely separating each tiny LED chip (measuring less than 200 μm) from the wafer—without damaging the chip’s light-emitting layer (the GaN layer). Currently, the industry commonly employs a combined process of “Laser Lift-Off (LLO) + Laser Cutting.”
- Photovoltaic field: Although the process of slicing photovoltaic cells is commonly referred to as "dicing," it essentially represents an extension of wafer cutting—specifically, dividing large silicon wafers (such as 182mm or 210mm) into smaller cell pieces (like half-cells or third-cells) to enhance the power density of PV modules. This requires high-speed, long-stroke dicing machines, while ensuring that the cut edges remain free of chipping—a critical factor to prevent cell breakage.
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