Medical and Biochip field
Medical and Biochip field
Microdevices in the medical field demand extremely high precision and biocompatibility, requiring wafer dicing machines to operate in an "ultra-clean environment" to prevent contamination.
- Biochip: Such as gene chips and protein chips, these devices integrate a large array of biosensor units on a wafer surface. Cutting must be performed carefully to ensure that the biological activity of each unit remains intact, while also leaving no residual impurities on the chip’s surface afterward—typically achieved using "dry laser cutting" to prevent contamination from cutting fluids.
- Medical microdevices—such as implantable sensors (for glucose or cardiac monitoring) and miniature surgical tools—are typically fabricated on wafers made from biocompatible materials like ceramics, sapphire, or specialized silicon-based substrates. Precision cutting is critical to meet medical-grade standards, with tolerances strictly below 10 μm, while ensuring that the cut surfaces remain perfectly smooth and free of burrs—preventing any potential damage to human tissue during implantation.
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