Kozhoo Wafer Dicing Machine Debuts at SEMI-e 2024, the Shenzhen International Semiconductor Exhibition
Release Time：2024-07-11
SEMI-e Shenzhen International Semiconductor Exhibition
Company Profile
Guangdong Kezhuo Semiconductor Equipment Co., Ltd. is dedicated to the research, development, and manufacturing of advanced semiconductor packaging equipment. Benchmarking against international peers, the company aspires to become China's leading domestic brand in cutting-edge packaging equipment. Its main products include: Wafer dicing machines, IC final-cutting equipment, high-speed sorting machines for IC finished products, and FC flip-chip die bonding machines Advanced packaging equipment, and more.
Exhibiting Equipment
At this exhibition, Kezhuo selected Wafer dicing machines, IC final-cutting equipment, and vision inspection systems Some models will be showcased at the event.
Wafer Dicing Machine (The Wafer Dicing Saw) is the star model featured at this year’s exhibition. Guided by a strategic vision to develop the most challenging and high-value semiconductor equipment, the company successfully pioneered the world’s first fully automated 12-inch dual-axis wafer dicing machine in 2018—making it one of the earliest Chinese enterprises to achieve this breakthrough. After seven years of continuous R&D and more than three years of real-world application in packaging plants, the machine now delivers cutting precision consistently below 3 μm, placing it on par with internationally advanced standards. Adhering to a product strategy that emphasizes "leveraging high-dimensional technology to enhance lower-dimensional applications," the wafer dicing machines have expanded their portfolio across all dimensions—from 12-inch down to 6-inch formats, from dual-axis to single-axis designs, and from fully automated to semi-automated models. These versatile machines are capable of slicing silicon wafers, SiC wafers, various types of substrates, and even magnetic materials, perfectly meeting the process requirements of customers in integrated circuits, discrete devices, and LED manufacturing.
Based on wafer dicing machine technology, the company has gradually expanded its R&D efforts since 2019 to develop IC Finished Product Cutting Machine (Package Singulation Dicing Saw), IC Finished Product High-Speed Sorting Machine (Jig Saw) and other backend packaging equipment have all achieved technical specifications that meet international advanced standards.
FC Flip-Chip Die Bonding Machine (Flip Chip) is a groundbreaking advanced packaging equipment developed by the company in 2021. This equipment is specifically designed for flip-chip die-attaching processes, delivering both high precision and exceptional speed while significantly improving product quality. It fills a critical gap in domestic production and is slated for full commercialization by 2025, with the company fully committed to achieving complete domestic substitution.
In 2024, Kozho marked its commercial breakthrough year with mass production. Within just six months, the company has already secured orders from over ten customers, receiving no negative feedback and enjoying high customer satisfaction. As a pioneer in domesticating China’s packaging equipment industry, Kozho boasts superior equipment performance, exceptional cost-effectiveness, a comprehensive range of models, short delivery cycles, and highly efficient service—making it an essential choice for packaging plants seeking supply-chain independence, cost reduction, and operational efficiency. Looking ahead to the next three years, Kozho plans to fully commercialize its equipment lineup, accelerate its journey toward listing on the STAR Market, and take the lead in driving China’s semiconductor packaging equipment sector toward greater self-reliance and innovation.
● Address: Building F7, Tian'an Digital City, No. 1 Huangjin Road, Nancheng Subdistrict, Dongguan City, Guangdong Province
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June 25–27, 2025
2025 SEMI-e 7th Shenzhen International Semiconductor Exhibition
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Recommended News
Recently, the highly anticipated 10th "Maker China" Guangdong Provincial SME Innovation and Entrepreneurship Competition—and the 9th "Maker Guangdong" Competition—delivered exciting news: Guangdong Quadro Semiconductor Equipment Co., LTD. impressed judges with its entry, the "High-Precision Fully Automatic Wafer Dicing Machine." Thanks to its cutting-edge technology and remarkable industry value, the company stood out from nearly 3,500 entries across the province, earning a spot among the competition's top 50 finalists. This achievement cements Quadro as a standout player in China's domestic semiconductor equipment sector.
Kozhoo Semiconductor's "High-Precision Fully Automatic Wafer Dicing Machine" project wins an award.
According to a report by China Securities Journal (reported by journalist Xia Zihang), on September 29, reporters learned from Kozuo Semiconductor that the company’s entry—a high-precision, fully automated wafer dicing machine—stood out among nearly 3,500 competing projects at the 10th Guangdong Provincial SME Innovation and Entrepreneurship Competition under the "Maker China" initiative, as well as the 9th "Maker Guangdong" competition. Thanks to its cutting-edge technological capabilities and significant industry value, Kozuo Semiconductor earned a spot in the top 50 of the competition, cementing its position as a leading player in China’s domestic semiconductor equipment sector.
Recently, Kozuo Semiconductor completed its first post-commercialization funding round, raising 70 million yuan. This investment will undoubtedly accelerate the commercial rollout of Kozuo’s wafer dicing machines, while also boosting China’s progress in developing domestically produced high-end packaging equipment.
At a critical juncture as China's domestic semiconductor industry moves toward independent innovation, a meaningful exchange and interaction unfolded brilliantly at Guangdong Quadro Semiconductor Equipment Co., LTD. Recently, faculty and students from the specialized class of the Financial Management program at the School of Accounting of Guangzhou Huashang College visited Kezhuo Semiconductor, embarking on a study-and-research journey to decode the rise of China's indigenous semiconductor sector—and together envisioning the future trajectory of industry development.
In May, the wind chimes sway gently in the soft glow of light, weaving together fragments of time into a prose poem dedicated to mothers. Outside the window, the flamboyant trees are already nurturing delicate buds—so reminiscent of a mother’s tender, downcast gaze as she sews, threading countless red threads that weave the warmth of岁月. And yet, even amidst the shimmering starlight of integrated circuit boards and the precision-cut paths of wafer-cutting machines, we can always sense the radiant presence of motherhood embedded in the very heart of technology.
Kezhuo: Domestication of wafer dicing machines will accelerate.
Recently, Kozhoo has accelerated efforts to commercialize its wafer dicing machines, which will also help advance the localization of China's high-end packaging equipment industry.
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