Wafer Dicing Machine
Keywords:
12-inch Dual Spindle Full-automatic
Applications include 8-12 inch silicon wafers, silicon carbide wafers, optical communication devices, ceramics and glass substrates, and magnetic materials.
8-inch Dual Spindle Full-automatic
Applications include 8-12 inch silicon wafers, silicon carbide wafers, optical communication devices, ceramics and glass substrates, and magnetic materials.
8-inch Single Spindle Semi-automatic
Applications include 8-12 inch silicon wafers, silicon carbide wafers, optical communication devices, ceramics and glass substrates, and magnetic materials.
6/8-inch Single-Axis Wafer Dicing Saw
6/8-inch silicon wafers, ceramic substrates, MINI LED light boards, and other electronic components.
Recently, the highly anticipated 10th "Maker China" Guangdong Provincial SME Innovation and Entrepreneurship Competition—and the 9th "Maker Guangdong" Competition—delivered exciting news: Guangdong Quadro Semiconductor Equipment Co., LTD. impressed judges with its entry, the "High-Precision Fully Automatic Wafer Dicing Machine." Thanks to its cutting-edge technology and remarkable industry value, the company stood out from nearly 3,500 entries across the province, earning a spot among the competition's top 50 finalists. This achievement cements Quadro as a standout player in China's domestic semiconductor equipment sector.
Kozhoo Semiconductor's "High-Precision Fully Automatic Wafer Dicing Machine" project wins an award.
According to a report by China Securities Journal (reported by journalist Xia Zihang), on September 29, reporters learned from Kozuo Semiconductor that the company’s entry—a high-precision, fully automated wafer dicing machine—stood out among nearly 3,500 competing projects at the 10th Guangdong Provincial SME Innovation and Entrepreneurship Competition under the "Maker China" initiative, as well as the 9th "Maker Guangdong" competition. Thanks to its cutting-edge technological capabilities and significant industry value, Kozuo Semiconductor earned a spot in the top 50 of the competition, cementing its position as a leading player in China’s domestic semiconductor equipment sector.
Recently, Kozuo Semiconductor completed its first post-commercialization funding round, raising 70 million yuan. This investment will undoubtedly accelerate the commercial rollout of Kozuo’s wafer dicing machines, while also boosting China’s progress in developing domestically produced high-end packaging equipment.
At a critical juncture as China's domestic semiconductor industry moves toward independent innovation, a meaningful exchange and interaction unfolded brilliantly at Guangdong Quadro Semiconductor Equipment Co., LTD. Recently, faculty and students from the specialized class of the Financial Management program at the School of Accounting of Guangzhou Huashang College visited Kezhuo Semiconductor, embarking on a study-and-research journey to decode the rise of China's indigenous semiconductor sector—and together envisioning the future trajectory of industry development.
In May, the wind chimes sway gently in the soft glow of light, weaving together fragments of time into a prose poem dedicated to mothers. Outside the window, the flamboyant trees are already nurturing delicate buds—so reminiscent of a mother’s tender, downcast gaze as she sews, threading countless red threads that weave the warmth of岁月. And yet, even amidst the shimmering starlight of integrated circuit boards and the precision-cut paths of wafer-cutting machines, we can always sense the radiant presence of motherhood embedded in the very heart of technology.
Kezhuo: Domestication of wafer dicing machines will accelerate.
Recently, Kozhoo has accelerated efforts to commercialize its wafer dicing machines, which will also help advance the localization of China's high-end packaging equipment industry.
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