Kozhoo Semiconductor's "High-Precision Fully Automatic Wafer Dicing Machine" project wins an award.
Release Time：2025-10-28
According to a report from China Securities Journal (reported by journalist Xia Zihang), on September 29, reporters learned from Kozuo Semiconductor that the company’s entry—a high-precision, fully automated wafer dicing machine—stood out among nearly 3,500 competing projects at the 10th Guangdong Provincial SME Innovation and Entrepreneurship Competition under the "Maker China" initiative and the 9th "Maker Guangdong" competition. Thanks to its cutting-edge technological capabilities and significant industry value, Kozuo Semiconductor earned a spot in the top 50 of the competition, cementing its position as a leading player in China’s domestic semiconductor equipment sector.
This year's competition focuses on eight cutting-edge fields, including semiconductors, intelligent manufacturing, and new materials, attracting a host of high-quality companies and innovative projects to compete on the same stage. The event unfolds across three key stages: city-level qualifiers, rigorous re-evaluation rounds, and the final showdown. Each round features a panel of industry experts and seasoned investors who conduct thorough assessments from multiple angles—covering technology, business potential, and team dynamics.
According to reports, since the R&D initiative was launched in 2017, the Kozuo Semiconductor team has spent eight years tackling numerous technical challenges. They successfully overcame hurdles involving the coordinated operation of over a thousand components and the seamless integration of dozens of core systems, ultimately achieving full domestic production of the equipment. Not only does this equipment deliver micron-level cutting precision, but it also slashes semiconductor companies' equipment procurement costs by more than 45% domestically. Currently, the device has been officially rolled out for mass production at several leading semiconductor packaging and testing firms, with some installations already exceeding four years of continuous operation. Its exceptional stability has earned high praise from customers, effectively filling the critical gap in the market for domestically produced, high-end wafer dicing equipment.
In addition to the "High-Precision Fully Automatic Wafer Dicing Machine," Kezhuo Semiconductor has developed a comprehensive range of packaging equipment, including wafer dicing machines, IC final-cutting systems, high-speed sorting machines for finished products, and FC die-attach machines.
Kozuo Semiconductor stated that it will fully leverage the advantages of the competition platform, deepen collaboration with companies across the semiconductor industry chain—both upstream and downstream—and continuously enhance the performance of products such as its "High-Precision Fully Automatic Wafer Dicing Machine." This effort aims to accelerate the widespread adoption of domestically produced semiconductor equipment in both large-scale and high-end applications, ultimately contributing to China's ongoing drive toward self-reliance in semiconductor manufacturing.
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Recently, the highly anticipated 10th "Maker China" Guangdong Provincial SME Innovation and Entrepreneurship Competition—and the 9th "Maker Guangdong" Competition—delivered exciting news: Guangdong Quadro Semiconductor Equipment Co., LTD. impressed judges with its entry, the "High-Precision Fully Automatic Wafer Dicing Machine." Thanks to its cutting-edge technology and remarkable industry value, the company stood out from nearly 3,500 entries across the province, earning a spot among the competition's top 50 finalists. This achievement cements Quadro as a standout player in China's domestic semiconductor equipment sector.
Kozhoo Semiconductor's "High-Precision Fully Automatic Wafer Dicing Machine" project wins an award.
According to a report by China Securities Journal (reported by journalist Xia Zihang), on September 29, reporters learned from Kozuo Semiconductor that the company’s entry—a high-precision, fully automated wafer dicing machine—stood out among nearly 3,500 competing projects at the 10th Guangdong Provincial SME Innovation and Entrepreneurship Competition under the "Maker China" initiative, as well as the 9th "Maker Guangdong" competition. Thanks to its cutting-edge technological capabilities and significant industry value, Kozuo Semiconductor earned a spot in the top 50 of the competition, cementing its position as a leading player in China’s domestic semiconductor equipment sector.
Recently, Kozuo Semiconductor completed its first post-commercialization funding round, raising 70 million yuan. This investment will undoubtedly accelerate the commercial rollout of Kozuo’s wafer dicing machines, while also boosting China’s progress in developing domestically produced high-end packaging equipment.
At a critical juncture as China's domestic semiconductor industry moves toward independent innovation, a meaningful exchange and interaction unfolded brilliantly at Guangdong Quadro Semiconductor Equipment Co., LTD. Recently, faculty and students from the specialized class of the Financial Management program at the School of Accounting of Guangzhou Huashang College visited Kezhuo Semiconductor, embarking on a study-and-research journey to decode the rise of China's indigenous semiconductor sector—and together envisioning the future trajectory of industry development.
In May, the wind chimes sway gently in the soft glow of light, weaving together fragments of time into a prose poem dedicated to mothers. Outside the window, the flamboyant trees are already nurturing delicate buds—so reminiscent of a mother’s tender, downcast gaze as she sews, threading countless red threads that weave the warmth of岁月. And yet, even amidst the shimmering starlight of integrated circuit boards and the precision-cut paths of wafer-cutting machines, we can always sense the radiant presence of motherhood embedded in the very heart of technology.
Kezhuo: Domestication of wafer dicing machines will accelerate.
Recently, Kozhoo has accelerated efforts to commercialize its wafer dicing machines, which will also help advance the localization of China's high-end packaging equipment industry.
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