Facing fierce competition, Kozuo Semiconductor’s “High-Precision Fully Automatic Wafer Dicing Machine” has successfully achieved a breakthrough—thanks to its ability to directly tackle the critical pain points plaguing China’s domestic semiconductor industry. Since the R&D initiative kicked off in 2017, Kozuo Semiconductor’s dedicated team spent eight years relentlessly overcoming one technological hurdle after another, mastering the intricate coordination of over a thousand components and seamlessly integrating dozens of core systems. This unwavering commitment ultimately led to the complete localization of the entire equipment. Not only does this machine deliver cutting-edge precision at the micrometer level, but it also slashes procurement costs for domestic semiconductor firms by more than 45%. Currently, the device has been officially adopted for mass production by several leading semiconductor packaging and testing companies, with some already operating it for over four years. Its exceptional stability has earned high praise from customers, effectively filling the market gap for domestically produced high-end wafer dicing equipment. As a result, the technology’s robustness and industry value have been unanimously recognized by the judging panel. Maker China "Great news comes from the Guangdong Provincial SME Innovation and Entrepreneurship Competition and the 9th 'Maker Guangdong' Contest—Guangdong Quadro Semiconductor Equipment Co., LTD. has made a standout achievement by advancing to the top 50 finalists with its "High-Precision Fully Automatic Wafer Dicing Machine." The company’s cutting-edge technology and significant industry value helped it stand out among nearly 3,500 competing projects from across the province, firmly establishing itself as a leading contender in China’s domestic semiconductor equipment sector."

The competition was fiercely contested, with the top 50 spots showcasing undeniable strength and skill.

As one of Guangdong Province's most prestigious and widely influential innovation and entrepreneurship competitions, this year's "Maker Guangdong" event focuses on eight cutting-edge fields, including semiconductors, intelligent manufacturing, and new materials, attracting a host of high-quality enterprises and groundbreaking projects to compete on the same stage. The competition unfolds across three key stages: city-level qualifiers, semi-final reviews, and the ultimate showdown. In each round, a panel of industry experts and seasoned investors rigorously evaluates entries from multiple dimensions—such as technology, business potential, and team dynamics—ensuring only the very best make it to the coveted top 50 spots, a selection process often described as "one in a hundred."

In the face of fierce competition, Kozuo Semiconductor’s “High-Precision Fully Automatic Wafer Dicing Machine” has successfully broken through, thanks to its ability to directly address the critical pain points plaguing China’s domestic semiconductor industry. Since the R&D initiative began in 2017, Kozuo Semiconductor’s dedicated team spent eight years tackling one technological challenge after another—overcoming hurdles in the coordinated operation of over a thousand components and achieving seamless integration across dozens of core systems. This relentless effort ultimately led to the localization of the entire equipment. Not only does this machine deliver cutting precision at the micrometer level, but it also slashes procurement costs for domestic semiconductor firms by more than 45%. Currently, the device has been officially adopted for mass production by several leading semiconductor packaging and testing companies, with some already operating it for over four years. Its exceptional stability has earned high praise from customers, effectively filling the market gap for domestically produced高端 wafer dicing equipment. As a result, the technology’s robustness and industry value have been unanimously recognized by the judging panel.

Deeply cultivating the innovation track, Kezhuo Semiconductor builds technological barriers.

In fact, in addition to the "High-Precision Fully Automatic Wafer Saw," the company has developed a range of products including wafer saws, IC package cutting machines, and high-speed sorting systems for finished products. Jigsaw ), FC die attach machines (Flip Chip) and other series of packaging equipment. Currently, the company has successfully applied for multiple core patents, establishing robust technological barriers that strongly underpin the competitiveness of its products.

Starting with the Top 50, driving the upgrade of China's domestic semiconductor industry.

For Kezhuo Semiconductor, making it into the top 50 of the "Maker Guangdong" competition is not the end but rather the starting point for a new journey. The organizing committee of the "Maker Guangdong" competition provides winning projects with comprehensive services spanning the entire value chain—ranging from industry-finance matchmaking and resource integration to technology incubation. Kezhuo Semiconductor will fully leverage the platform’s advantages to deepen collaboration with companies across the semiconductor industry’s upstream and downstream sectors, continuously enhancing the performance of products like its "High-Precision Fully Automatic Wafer Dicing Machine." This effort will help drive more domestically produced semiconductor equipment toward large-scale, high-end applications, ultimately contributing to China’s ongoing push for self-reliance in semiconductor manufacturing.