Recently, Kozuo Semiconductor completed its first post-commercialization funding round, raising 70 million yuan. This investment will undoubtedly accelerate the commercial rollout of Kozuo’s wafer dicing machines, while also boosting China’s progress in developing domestically produced high-end packaging equipment.

Wafer dicing is a critical step in the chip packaging process, and the wafer saw is the primary packaging equipment used. Due to the equipment's exceptionally high precision and stability, coupled with the relatively late start of China's related industries, over 90% of the domestic market currently relies on imports—particularly for high-end models like the 12-inch fully automatic wafer saws, which are almost entirely dependent on foreign suppliers. As wafer dicing machines account for a significant portion of investment costs in packaging facilities, China's domestic market not only boasts a large scale but also rapid growth. Therefore, achieving localization of this crucial equipment is essential for China's semiconductor industry to attain self-reliance and control, while simultaneously helping companies reduce costs and improve efficiency.

Founded in 2016 and headquartered in Dongguan, Kezhuo Semiconductor focuses on the research, development, manufacturing, and sales of high-end semiconductor packaging equipment. Committed to domestic innovation, Kezhuo consistently prioritizes independent, original technology. In 2018, the company pioneered the successful development of China's first fully automated 12-inch wafer saw—a groundbreaking achievement that has since been refined through eight years of R&D, eight iterative upgrades, and more than four years of rigorous field testing. Today, Kezhuo offers a comprehensive range of advanced equipment, including the Wafer Saw for wafer dicing, the Package Saw for IC final-cutting applications, the JigSaw for high-speed sorting of finished products, and the Flip Chip machine for FC die bonding. With nearly 20 packaging clients already relying on its precision 2-micron systems, Kezhuo’s solutions are renowned for their exceptional stability and reliability, placing the company at the forefront of China’s semiconductor packaging technology sector.

2025 is a pivotal year for Kozho Semiconductor’s commercialization—marking the year we’ll ramp up large-scale production, secure key customer partnerships, and capture significant orders. We’re set to execute an expansion plan targeting nearly 20 major clients, while also launching development initiatives to enhance the advanced functionalities of our existing equipment and validate new, cutting-edge technologies. Additionally, we’ll expand our state-of-the-art dust-free assembly facilities, recruit top talent in sales, production, and management, and elevate our expertise in sales, manufacturing, and supply chain operations—all as we strive relentlessly toward becoming a leading domestic player in the industry.

Kezhuo people firmly believe in the business philosophy of "Only by being the best version of ourselves can we create value for our customers," and have spent eight years meticulously refining their semiconductor equipment to deliver products of exceptional quality. Today, the company’s equipment boasts superior performance, short delivery cycles, significant cost advantages, and highly efficient service—providing robust support to China’s packaging clients in achieving supply-chain autonomy, control, and enhanced cost-effectiveness.

Over the next three years, Kezhuo will remain focused on the high-end packaging sector, striving to become a leading domestic enterprise driving the localization of advanced semiconductor packaging equipment in China—and contributing significantly to the country’s broader efforts to localize its semiconductor industry.