Recently, Kozhoo has accelerated efforts to commercialize its wafer dicing machines, which will also help advance the localization of China's high-end packaging equipment industry.

Wafer dicing is a critical step in the chip packaging process, and the wafer saw is the primary packaging equipment used. Due to the equipment's exceptionally high precision and stability, coupled with the relatively late start of China's related industries, over 90% of the domestic market currently relies on imports—particularly for high-end models, such as the 12-inch fully automatic wafer saws, which are almost entirely dependent on foreign suppliers. As wafer dicing machines account for a significant portion of investment costs in packaging facilities, China's domestic market not only boasts a large scale but also rapid growth. Therefore, achieving localization of this crucial equipment is an essential path for China's semiconductor industry to attain self-reliance, control, and enhanced efficiency while helping companies reduce costs and boost productivity.

Founded in 2016 and headquartered in Dongguan, Kezhuo Semiconductor focuses on the R&D, manufacturing, and sales of high-end semiconductor packaging equipment. Committed to domestic innovation, Kezhuo has consistently prioritized independent, original research and development. In 2018, the company pioneered the successful development of China's first fully automated 12-inch wafer saw—a groundbreaking achievement that marked a significant milestone in the industry. Over eight years of dedicated R&D, eight iterative improvements, and more than four years of rigorous field testing, Kezhuo has now developed a comprehensive range of advanced equipment, including the Wafer Saw, Package Saw for IC final-cutting, the high-speed sorting machine for finished products (JigSaw), and the Flip Chip bonding machine (FC). Today, nearly 20 packaging clients rely on Kezhuo’s cutting-edge technology, which delivers exceptional precision—down to 2 microns—and unparalleled reliability, positioning the company at the forefront of China’s semiconductor equipment industry.

2025 is a pivotal year for Kozho Semiconductor’s commercialization—marking the year we’ll ramp up large-scale production, secure key customer partnerships, and capture significant orders. We’re set to execute an expansion plan targeting nearly 20 major clients, while also launching development initiatives to enhance the capabilities of our existing equipment and validate cutting-edge new technologies. Additionally, we’ll expand our state-of-the-art dust-free assembly facility, recruit top talent in sales, production, and management, and elevate our expertise in sales, manufacturing, and supply chain operations—all as we strive relentlessly toward becoming a leading domestic player in the industry.

Kezhuo people firmly believe in the business philosophy of "being your authentic self is the key to creating value for customers," and have spent eight years meticulously crafting high-quality, domestically produced semiconductor equipment. Today, the company’s equipment boasts excellent performance, short delivery times, significant cost advantages, and highly efficient service—providing robust support to China’s packaging clients in achieving supply-chain autonomy, control, and enhanced cost-effectiveness.

Over the next three years, Kezhuo will remain focused on the high-end packaging sector, striving to become a leading domestic enterprise driving the localization of advanced semiconductor packaging equipment in China—and contributing significantly to the country’s broader efforts to localize its semiconductor industry.

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