Kozhoo Semiconductor Completes RMB 70 Million Series A Funding; Domestic Production of Wafer Dicing Machines Expected to Accelerate.
Release Time：2025-05-07
According to a report from Shanghai Securities News (reported by journalist Xia Zihang), on May 6, KZ Semiconductor announced via its official WeChat public account that the company recently closed its first post-commercialization funding round, raising 70 million yuan. This significant investment will accelerate the commercial rollout of KZ's wafer dicing machines while also supporting China's ongoing efforts to localize high-end packaging equipment technology.
According to reports, wafer dicing is a critical step in the chip packaging process, and the wafer saw is the primary equipment used for this task. Given the extremely high demands for precision and stability in these machines, coupled with the relatively late start of China's related industries, over 90% of the domestic market currently relies on imports—particularly for high-end models like the 12-inch fully automatic wafer saws, which are almost entirely dependent on foreign suppliers. As wafer saws account for a significant portion of investment costs in packaging facilities, and considering the large and rapidly growing domestic market, advancing the localization of this crucial equipment is essential for China’s semiconductor industry to achieve self-reliance, control, and cost reduction while boosting efficiency for businesses.
Founded in 2016, Kezhuo Semiconductor focuses on the research, development, manufacturing, and sales of high-end semiconductor packaging equipment. Committed to independent innovation, Kezhuo successfully developed China's first fully automated 12-inch wafer saw in 2018. After eight years of intensive R&D, eight iterative improvements, and more than four years of rigorous field testing, the company has now introduced a comprehensive lineup of advanced equipment, including wafer saws, IC package saws, high-speed sorting machines for finished products (Jig Saw), and flip-chip bonding machines (Flip Chip). Currently, nearly 20 packaging customers are already utilizing these cutting-edge solutions, with precision reaching as low as 2 microns—placing Kezhuo at the forefront of the domestic industry.
Kozuo Semiconductor stated that 2025 is a pivotal year for the company’s commercialization, marking the beginning of significant expansion into key accounts, securing new orders, and ramping up large-scale production. The company will roll out an expansion plan targeting nearly 20 major clients, kick off development work on advanced features for several existing pieces of equipment, and validate new equipment models. Additionally, Kozuo plans to expand its state-of-the-art dust-free assembly facilities, while also recruiting top talent in sales, production, and other management roles to enhance its capabilities in sales, manufacturing, and supply chain operations. Dedicated to becoming a leading enterprise driving the localization of high-end semiconductor packaging equipment in China.
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Kezhuo: Domestication of wafer dicing machines will accelerate.
Recently, Kozhoo has accelerated efforts to commercialize its wafer dicing machines, which will also help advance the localization of China's high-end packaging equipment industry.
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