Kezhuo Semiconductor focuses on the production of high-end packaging equipment and may launch its first round of PE financing within the year.
Release Time：2024-11-22
BEIJING, Nov. 22 (by Kang Gengfu) — The 21st China International Semiconductor Expo (IC China 2024), hosted by the China Semiconductor Industry Association, recently kicked off at the Beijing National Convention Center. Wang Fuguo, CEO of Guangdong Quadro Semiconductor Equipment Co., LTD. (referred to as "Kerzhuo Semiconductor"), told Xinhua Finance that after seven years of intensive R&D, four years of real-world production line validation, and eight iterative upgrades, the company has now entered the commercialization phase this year and plans to complete its first round of PE financing within the year.
According to estimates, the current total market for wafer dicing machines in China is approximately $2 billion, with projections indicating it will reach $3.5 billion by 2027. As AI, autonomous driving, and personal… Robot (20.910, 0.23, 1.11% ) The advancement of technologies, along with the adoption of multi-path advanced packaging processes such as flip-chip, wafer-level packaging, system-in-package integration, and 2.5D/3D packaging, is driving new requirements and increasing demand for packaging equipment. Meanwhile, the domestic production rate of packaging equipment remains below 5%, with even lower rates for high-end models.
Founded in 2016, Kezhuo Semiconductor focuses on the research, development, production, and sales of high-end semiconductor packaging equipment. Committed to independent innovation, the company successfully developed a fully automated 12-inch wafer dicing machine in 2018. After seven years of intensive R&D, four years of practical production line validation, and eight iterative improvements, Kezhuo has now introduced a comprehensive range of advanced packaging equipment—including wafer dicing machines, IC final-cutting systems, high-speed sorting machines for finished products, and FC flip-chip die bonders—many of which are already in operation at nearly two dozen packaging customers. These solutions deliver consistently stable cutting quality with precision maintained within 2 microns, placing Kezhuo’s technology on par with international industry leaders.
Kozuo Semiconductor CEO Wang Fuguo told Xinhua Finance that 2024 marks Kozuo’s first year of commercialization. The company has been actively advancing initiatives such as customer expansion, supply chain optimization, production and R&D facility upgrades, and talent acquisition. In just over six months, Kozuo has established partnerships with nearly 20 packaging clients. Meanwhile, the company’s equipment—boasting superior quality, cutting-edge technology, and exceptional service—has earned unanimous praise from numerous customers, positioning Kozuo as a key domestic alternative for semiconductor packaging equipment in China.
"Choosing to commercialize this year is primarily based on three key reasons. First, the precision and stability of our equipment have become increasingly mature, with technical specifications now matching international standards. Second, the semiconductor industry as a whole is experiencing a robust recovery this year, driving customers to ramp up production—and consequently boosting strong demand for our equipment. Finally, growing market awareness of domestic semiconductor equipment manufacturing, coupled with the rising need for cost reduction and efficiency improvements, along with increasingly supportive national industrial policies, are all playing a crucial role," said Wang Fuguo.
It is understood that the company adheres to a technology strategy of "leading-edge technologies guiding more conventional ones," coupled with a research-and-development mindset rooted in craftsmanship. Upholding the approach of "mastering precision before scaling up," the company kicked off its R&D journey by developing the most technically demanding 12-inch fully automated dual-axis wafer dicing machine. In 2018, it successfully launched its first 12-inch model, and since then has steadily expanded its product line downward to include 8-inch and 6-inch machines, securing a pioneering edge in domestic technology. Today, Kezhuo boasts a comprehensive lineup of semiconductor equipment, boasts short delivery cycles, and offers significant cost advantages, providing robust support to China's packaging customers in achieving supply-chain autonomy, control, and enhanced efficiency while driving down costs.
"Kezhuo plans to launch its first round of PE financing this year and aims to achieve 500 million yuan in revenue by 2026, creating 300 jobs and contributing 200 million yuan in profits and taxes. The company also intends to apply for an IPO on the STAR Market in 2027, positioning itself as a leading domestic player in semiconductor packaging equipment and playing a vital role in advancing the localization of China's semiconductor industry," said Wang Fuguo.
Editor: Hu Chenxi
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