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Second Floor, Building 7, Block F, Tian'an Digital City, Nancheng District, Dongguan City, Guangdong Province
Flip-Chip Die Bonder (FC Die Attach Machine)
Category:
Excellent structural design.
Reliable and convenient operating system.
Details
• Product Advantages
High-precision (±5 µm) speed control, dual worktables with alternating dual nozzles for operation, contactless visual alignment, and automatic correction functionality.
• Scope of Application
High-precision (±5 µm) speed control, dual worktables with alternating dual nozzles for operation, contactless visual alignment, and automatic correction functionality.
• Equipment Features
Contactless visual alignment system with automatic correction functionality. Enables quick, in-line material changes during production without requiring machine downtime. Features dual-head mounting for significantly faster productivity gains. The XY-axis motion tracks are equipped with a robust dual-rail design. Intuitive human-machine interface provides real-time monitoring of the mounting process. Boasts a highly precise and stable mechanical structure, along with reliable transmission components.
• Product Specifications
Project | Parameter value |
Device Name | Flip-chip Mounting Machine |
Device Model | DFC-1202A |
Production Capacity (UPH) | 6000 (related to process parameter requirements) |
Fit accuracy (μm) | ±5μm |
Strong adhesion to the head | 1N-40N |
Wafer Size | Up to 12 inches |
Positioning Method | Still photography + motion photography |
Number of material stacks | 100 (8mm is the standard) |
Feeder Type | NXT-compatible electric |
Automatic nozzle changing | Support |
Power | 4.5KW |
Power supply | Three-phase AC 380V |
Compressed air | 0.5-0.7MPa |
Equipment dimensions | 3200x1310x1708mm (Length x Width x Height) |
Equipment weight | Approximately 2,600 kg |
Keywords:
Wafer Dicing Machine
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Address: Second Floor, Building 7, Block F, Tian'an Digital City, Nancheng District, Dongguan City, Guangdong Province
