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6/8-inch Single-Axis Wafer Dicing Saw
Category:
Excellent structural design.
Reliable and convenient operating system.
Details
• Product Advantages
High cutting precision (within 0.003 mm / 210 mm), excellent stability, CCD-based automatic positioning and calibration, simultaneous cutting and cleaning, independently developed software and hardware, and user-friendly human-machine interaction.
• Scope of Application
6/8-inch silicon wafers, ceramic substrates, MINI LED light boards, and other electronic components.
• Equipment Parameter
Project | Parameter value | |
Device Name | 6/8-inch Single-Axis Wafer Dicing Machine | |
Device Model | QWD681M | |
Workpiece Size | Φ6”/Φ8” | |
X-axis | Cutting Range | 210mm |
Cutting Speed | 0.1-800mm/s | |
Y-axis | Cutting Range | 160-210mm |
Single Step | 0.0001mm | |
Index Positioning Accuracy | 0.005/160mm 0.002/210mm | |
Z-axis | Max. stroke | 32.2 mm (Φ2" blades) |
Moving resolution | 0.00002mm | |
Repeatability accuracy | 0.001mm | |
θ axis | Max. rotating angle | 320° |
Spindle | Revolution speed range (min-1) | 3,000–40,000 / 6,000–60,000 |
Rated Output (kW) | 2.0 at 40,000 rpm / 1.8 at 60,000 rpm | |
Rated Torque (N·m) | 0.48 / 0.29 | |
Other specifications | Equipment Size (L × W × H) | 650 x 950 x 1,670 mm |
Equipment weight | ≈650 kg | |
• Terms of Use
→ Clean compressed airwith atmospheric dew point between-10℃to-20℃,residualoil content of 0.1ppm,andfiltrationrating of 0.01 μm/99.5%or higher.
→ Maintain the room temperature where the machinery is placed between 20℃to 25℃ and control the fluctuation within±1℃.
→ Control the temperature of the cutting water tobe at room temperature+2℃,with fluctuations within±1℃.
→ Control the temperature of the cooling water to be the same as room temperature,with fluctuations within±1℃.
Keywords:
Wafer Dicing Machine
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Address: Second Floor, Building 7, Block F, Tian'an Digital City, Nancheng District, Dongguan City, Guangdong Province
