undefined
+
  • undefined

8-inch Single Spindle Semi-automatic


Excellent structural design.

• High rigidity body ensures stable operation of the machine. • Special high rigidity design of the X-axis significantly improves rapid traverse speed, enhancing production efficiency. • Optimized spindle spacing to 20mm effectively increases production efficiency. • Standard configuration with square trays accommodates more products compared to round trays. • Centralized lubrication system for easier maintenance, ensuring long-term precision of the machine.

Reliable and convenient operating system.

• 15-inch touch screen display shows more machine status information, with simple and smooth operation. • All fluids are controlled by software and stored in program groups, saving time for product changeover adjustments. • Specialized software for multiple cutting paths achieves 10% faster speed than conventional cutting methods. • Self -developing motion control and image analysis Algorithm improve system reliability and stability. • PrSemiconductor standard communication protocol facilitates integration with factory automation systems.

Details

Product Advantages

High cutting precision (within 0.005 mm / 220 mm), excellent stability, and optimized spindle spacing reduced to within 20 mm—effectively boosting production efficiency by 5–10%.

 

Application range

Cutting of packaged products, DFN, QFN, BGA, ceramic substrates, mini LED light boards.

 

Product Specifications

Project

Parameter value

Device Name

8-inch Single Spindle Semi-automatic

Device Model

QPD801M

Maximum size of workpiece

210 x 210 mm (L x W)

X-axis

Dicing Range

220mm

Feed Speed Input Range

0.1-1000mm/s

Y-axis

Dicing Range

220mm

Single step

0.0001mm

Y axis positional accuracy

Within 0.005 mm / 220 mm

Z-axis

Maximum valid stroke

25 mm (with Φ2" blade)

Movement resolution

0.0001mm

Repeat accuracy

0.003mm

Maximum blade diameter

Φ60mm

Theta axis

Maximum rotation angle

380°

Spindle

Operating speed range (RPM)

10,000–60,000

Maximum Power (kW)

1.8 / 2.4 at 60,000 rpm

Torque (N·m)

0.3 / 0.4 (15,000 - 60,000 rpm)

Broken Blade Online Detection

Yes

Blade presetting with Non-Contact Sensor

Yes

GEM communication protocol

Yes

Maximum frame size

210 x 210 mm (L x W)

Other specifications

Power

Single-phase AC 220V

Equipment Size

1020 x 890 x 1750 mm

(L × W × H)

Equipment weight

≈800 kg

 

Terms of Use

→ Clean compressed airwith atmospheric dew point between-10℃to-20℃,residualoil content of 0.1ppm,andfiltrationrating of 0.01 μm/99.5%or higher.
→ Maintain the room temperature where the machinery is placed between 20℃to 25℃ and control the fluctuation within±1℃.
→ Control the temperature of the cutting water tobe at room temperature+2℃,with fluctuations within±1℃.
→ Control the temperature of the cooling water to be the same as room temperature,with fluctuations within±1℃.

Keywords:

Wafer Dicing Machine

Online Consultation

Please leave your email address, and our experts will get in touch with you as soon as possible!


Address: Second Floor, Building 7, Block F, Tian'an Digital City, Nancheng District, Dongguan City, Guangdong Province

Copyright: Guangdong Quadro Semiconductor Equipment Co., LTD.

%E7%AC%AC%E4%B8%80%EF%BC%8C%E6%9C%80%EF%BC%8C%E4%BC%98%E7%A7%80%EF%BC%8C%E5%A2%9E%E5%BC%BA%EF%BC%8C%E4%B8%80%E6%B5%81%EF%BC%8C%E5%8D%93%E8%B6%8A%EF%BC%8C%E9%A2%86%E5%85%88%EF%BC%8C%E5%85%88%E8%BF%9B%EF%BC%8C%E5%BC%95%E9%A2%86

Sorry,当前栏目暂无内容!

您可以查看其他栏目或返回 首页

Sorry,The current column has no content!

You can view other columns or return Home