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Finished Product High-Speed Sorting Machine


Excellent structural design.

• Dual worktable dual-axis cutting for rapid increase in production efficiency, achieving up to 30K UPH efficiency. • Maximum substrate size for cutting: 100mm300mm; minimum product size: 2mm*2mm. • Linear drive, fully closed-loop trajectory control, with 16 sets of sorting suction nozzles. • 1200w HD industrial camera for blade damage detection; 6-side inspection, supports GEM protocol. • High-precision, high-stability mechanical and transmission structures.

Reliable and convenient operating system.

Details

Product Advantages

High-precision, high-stability machine body; dual worktables with dual-axis cutting; full closed-loop trajectory control; 16 sets of sorting suction nozzles.


 

Application range

Cutting of packaged products, DFN, QFN, BGA, ceramic substrates, mini LED light boards.


 

Product Specifications

Project

Parameter value

Device Name

Finished Product High-Speed Sorting Machine

Device Model

JIG30K-I/JIG30K-II

Cutting table

Dual Cutting Table

Cutting spindle

Dual-spindle 2.4kW

Product Dimensions

3-20mm

Product thickness

0.5-4mm

Image Processing System

12MPIX

Substrate Size

100mm * 300mm

Cutting Type

QFN.DFN.BGA.TF

Payload

3 x 20 groups

UPH

Upto30000

 

 

Keywords:

Wafer Dicing Machine

Online Consultation

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Address: Second Floor, Building 7, Block F, Tian'an Digital City, Nancheng District, Dongguan City, Guangdong Province

Copyright: Guangdong Quadro Semiconductor Equipment Co., LTD.

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