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Phone:
13509020466
Landline:
0769-28829280
Email:
Sd01@qrobotweb.com
Address:
Second Floor, Building 7, Block F, Tian'an Digital City, Nancheng District, Dongguan City, Guangdong Province
8-inch Single Spindle Semi-automatic
Category:
Excellent structural design.
Reliable and convenient operating system.
Details
• Product Advantages
High cutting precision (within 0.003mm / 220mm), excellent stability, CCD-based automatic positioning and correction, simultaneous cutting and cleaning, independently developed software and hardware, and user-friendly human-machine interaction.
• Applications
8-12 inch silicon wafers, silicon carbide wafers, optical communication devices, ceramics and glass substrates, and magnetic materials.
• Product Specifications
Project | Parameter value | |
Device Name | 8-inch Single Spindle Semi-automatic | |
Device Model | QWD801M | |
Maximum size of workpiece | Φ210mm | |
X-axis | Dicing Range | 220mm |
Feed Speed Input Range | 0.1-1000mm/s | |
Y-axis | Dicing Range | 220mm |
Single step | 0.0001mm | |
Y axis positional accuracy | Within 0.003 mm / 220 mm | |
Z-axis | Maximum valid stroke | 14.7 mm (with Φ2" blade) |
Movement resolution | 0.00005mm | |
Repeat accuracy | 0.001mm | |
Maximum blade diameter | Φ58mm | |
θ axis | Maximum rotation angle | 380° |
Spindle | Operating speed range (RPM) | 10,000–60,000 |
Maximum Power (kW) | 1.8 / 2.4 at 60,000 rpm | |
Torque (N·m) | 0.3 / 0.4 (15,000 - 60,000 rpm) | |
Broken Blade Online Detection | There is | |
Blade presetting with Non-Contact Sensor | There is | |
Automatic sharpening | There is | |
GEM communication protocol | There is | |
Maximum frame size | 6-8inches | |
Other specifications | Power | Single-phase AC 220V |
Equipment Size | 1020 x 890 x 1750 mm(L × W × H) | |
Equipment weight | Approximately 800 kg | |
• Terms of Use
→ Clean compressed airwith atmospheric dew point between-10℃to-20℃,residualoil content of 0.1ppm,andfiltrationrating of 0.01 μm/99.5%or higher.
→ Maintain the room temperature where the machinery is placed between 20℃to 25℃ and control the fluctuation within±1℃.
→ Control the temperature of the cutting water tobe at room temperature+2℃,with fluctuations within±1℃.
→ Control the temperature of the cooling water to be the same as room temperature,with fluctuations within±1℃.
Keywords:
Flip-chip die bonder
IC Finished Product Cutting Machine
Wafer Dicing Machine
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Address: Second Floor, Building 7, Block F, Tian'an Digital City, Nancheng District, Dongguan City, Guangdong Province
