Flip-chip die bonder
Keywords:
8-inch Dual Spindle Full-automatic
Applications include 8-12 inch silicon wafers, silicon carbide wafers, optical communication devices, ceramics and glass substrates, and magnetic materials.
8-inch Single Spindle Semi-automatic
Applications include 8-12 inch silicon wafers, silicon carbide wafers, optical communication devices, ceramics and glass substrates, and magnetic materials.
Kezhuo: Domestication of wafer dicing machines will accelerate.
Recently, Kozhoo has accelerated efforts to commercialize its wafer dicing machines, which will also help advance the localization of China's high-end packaging equipment industry.
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