Product

Product

12-inch Dual Spindle Full-automatic

12-inch Dual Spindle Full-automatic

Applications include 8-12 inch silicon wafers, silicon carbide wafers, optical communication devices, ceramics and glass substrates, and magnetic materials.
8-inch Dual Spindle Full-automatic

8-inch Dual Spindle Full-automatic

Applications include 8-12 inch silicon wafers, silicon carbide wafers, optical communication devices, ceramics and glass substrates, and magnetic materials.
8-inch Single Spindle Semi-automatic

8-inch Single Spindle Semi-automatic

Applications include 8-12 inch silicon wafers, silicon carbide wafers, optical communication devices, ceramics and glass substrates, and magnetic materials.
6/8-inch Single-Axis Wafer Dicing Saw

6/8-inch Single-Axis Wafer Dicing Saw

6/8-inch silicon wafers, ceramic substrates, MINI LED light boards, and other electronic components.
6-inch Single Spindle Semi-automatic

6-inch Single Spindle Semi-automatic

Applicable scope: Electronic components such as 6-inch silicon wafers, ceramic substrates, and MINI LED light boards.
Finished Product High-Speed Sorting Machine

Finished Product High-Speed Sorting Machine

Application range: Cutting of packaged products, DFN, QFN, BGA, ceramic substrates, mini LED light boards.
12-inch Dual Spindle Semi-automatic

12-inch Dual Spindle Semi-automatic

Application range: Cutting of packaged products, DFN, QFN, BGA, ceramic substrates, mini LED light boards.
8-inch Dual Spindle Semi-automatic

8-inch Dual Spindle Semi-automatic

Application range: Cutting of packaged products, DFN, QFN, BGA, ceramic substrates, mini LED light boards.
12-inch Single Spindle Semi-automatic

12-inch Single Spindle Semi-automatic

Application range:Cutting of packaged products, DFN, QFN, BGA, ceramic substrates, mini LED light boards.
8-inch Single Spindle Semi-automatic

8-inch Single Spindle Semi-automatic

Application range:Cutting of packaged products, DFN, QFN, BGA, ceramic substrates, mini LED light boards.
Flip-Chip Die Bonder (FC Die Attach Machine)

Flip-Chip Die Bonder (FC Die Attach Machine)

Scope of application: Integrated solutions for backend processes in encapsulated products, including cutting, cleaning, drying, inspection, sorting, and tray loading.
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Guangdong Quadro Semiconductor Equipment Co., Ltd. 广东科卓半导体设备有限公司

Phone: 13509020466

Landline: 0769-28829280

Email: Sd01@qrobotweb.com

Address: Second Floor, Building 7, Block F, Tian'an Digital City, Nancheng District, Dongguan City, Guangdong Province

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Copyright: Guangdong Quadro Semiconductor Equipment Co., LTD.

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