IC Finished Product Cutting Machine
Keywords:
8-inch Single Spindle Semi-automatic
Applications include 8-12 inch silicon wafers, silicon carbide wafers, optical communication devices, ceramics and glass substrates, and magnetic materials.
Recently, Kozuo Semiconductor completed its first post-commercialization funding round, raising 70 million yuan. This investment will undoubtedly accelerate the commercial rollout of Kozuo’s wafer dicing machines, while also boosting China’s progress in developing domestically produced high-end packaging equipment.
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